Xiaomi 14 Ultra teardown reveals several internal design changes
The Xiaomi 14 series debuted globally at an event in Barcelona and included two models: Xiaomi 14 and Xiaomi 14 Ultra. The former is set to launch in India on March 7th. The phones retain Leica optics and ship with Qualcomm Snapdragon 8 Gen 3 SoC. Now, the Xiaomi 14 Ultra teardown is out, and it reveals the internal design of the phone. Check out the details.
Xiaomi 14 Ultra teardown
- The Xiaomi 14 Ultra looks identical to its predecessor but there are numerous internal changes.
- The back panel of the phone can be peeled off easily, with glue coming off easily with the right amount of heat.
- Xiaomi 14 Ultra’s back panel has a leather finish similar to the predecessor and this looks quite good.
- We get a slightly larger motherboard casing. There is the new wireless charging coil and this supports 80W fast charging.
- There is a larger heat dissipation film below the charging and NFC coil. This will eliminate any overheating issues, especially during intense tasks or while gaming.
- There is an IP68 rating for water and dust resistance. We see rubber gaskets covering the entry points like the SIM tray section.
- The teardown video shows key components of the phone like the storage, battery and others.
The teardown video also posts comparative camera samples of the Xiaomi 13 Ultra and 14 Ultra. There are notable improvements in long-range zoom shots, thanks to the ‘Ultra-Zoom’ feature. The video also performs a battery charging test, revealing the 5,300mAh battery can recharge at a maximum of 73.6watts via USB Type-C and achieves a full charge in just 41 minutes.
The display measurements show impressive brightness levels, reaching up to 1045 units in full-screen mode. The Qualcomm Snapdragon 8 Gen 3 is quite impressive in gaming and general tasks.
The post Xiaomi 14 Ultra teardown reveals several internal design changes first appeared on 91mobiles.com.
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