Intel Innovation 2023 highlights: Meteor Lake, 3D-V Cache alternative, and other announcements
Intel Innovation Day just ended and it showcased many of Intel’s high-end technologies, some ready while others in the pipeline. We got to learn about its upcoming client processor called Meteor Lake, its next-to-next processor called Lunar Lake, and its answer to AMD’s 3D V-Cache, among many other things. Here we will be taking a look at the major announcements from Intel’s forward-looking event. This should also give us an idea of where the larger chip industry is also moving.
5 upcoming Intel technologies announced at Innovation Day 2023
The most near-term product from a consumer standpoint would be the next-in-line Meteor Lake chips. So, let’s begin with that.
Meteor Lake and other chips
Meteor Lake will follow the 13th-generation Raptor-lake and is poised to introduce several new advancements in chip technology. It will launch on December 14, 2023.
- For starters, it is based on the Intel 4 process, which is only a 7nm architecture, but it is the first time the company is using EUV Lithography to manufacture a chip. It is said to offer 20-percent performance gains with the same power envelope as its predecessor. In simpler terms, it is more efficient than the Intel 7 used on Raptor Lake chips.
- The 14th-generation Meteor Lake adopts a hybrid tile-based chiplet design consisting of small but dedicated modular tiles like compute, graphics, SoC, and I/O.
- Since it also comes with a P and E core structure, you have the latter handling lower-powered processes, resulting in more efficiency.
- MTL (Meteor Lake) sports a dedicated NPU for AI-centric tasks, and some SKUs with dual-channel memory have the company’s proprietary ARC graphics built in.
- You also get an integrated memory controller, native HDMI 2.1, and DisplayPort 2.1 support.
Intel CEO Pat Gelsinger also confirmed the arrival of Arrow Lake (3nm) in 2024, Lunar Lake (1.8nm) in 2024 and Panther Lake in 2025.
3D V-Cache alternative
3D V-Cache is an AMD technology that places a high-speed short-memory cache on top of the CPU. This allows a lower latency and faster processing speed as compared to a CPU relying on RAM or other cache components.
As expected, the performance improvements from 3D V-Cache were so impressive that Intel had to work on its version soon. At the Innovation Day, it revealed it is cooking something and we should see it announced somewhere down the line.
Pike Creek
Chiplets, as you may know, are small, modular chips that combine to form a bigger chip. Now, what Pike Creek proposes is that the larger chip could consist of several chiplets perhaps even from different companies. These could be added and removed like plug-and-play.
This would enable chipmakers with unique expertise to work on their niche and excel at that technology. This would be good for the entire chip’s capabilities.
Pike Creek is professed to be the world’s first working UCIe-enabled chiplet-based processor. UCIe is the underlying standard for this modular tech and also the name of the standards body behind it.
Glass substrate for chip packaging
Intel has also revealed its plans to change the foundation for chip packaging from resin to glass substrate. This is said to offer improved data transfer, reduced warping, and enhanced heat resistance.
AI capabilities
Hardly any tech event these days concludes without big AI announcements. Intel also talked about:
- The dedicated AI co-processor on Meteor Lake for low-latency AI computing.
- Its large AI supercomputer with Intel Xeon processors and 4,000 Intel Gaudi2 deep learning processors, will be used by Stability AI.
- Xeon Scalable processors for data centres and generative AI training.
The post Intel Innovation 2023 highlights: Meteor Lake, 3D-V Cache alternative, and other announcements first appeared on 91mobiles.com.
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